Alphacool Eisblock Aurora RX 7900XTX Reference with Backplate

The next generation - the Alphacool Eisblock Aurora water cooler for Radeon RX 7XXX graphics cards. In order to dissipate the enormous heat of this graphics card generation in the best possible way, numerous optimizations have been made to the water cooler compared to the previous model. The fin structure was adapted and enables a very good water flow while increasing the cooling surface. The modified jet plate with improved inflow engine ensures an optimal distribution of the water on the cooling fins.

Technical Highlights
The fin structure of this Eisblock cooler generation was developed together with AMD board partners. The fin thickness is 0.4 mm, the distance between the cooling fins is 0.4 mm. This ensures a very good water flow while increasing the cooling surface. The jet plate has a revised inlay that spreads the water pressure better over the fins thus optimizing the heat absorption. The adjusted water inflow gives the water a better angle of inflow.

Chrome-plated copper
The cooler is made entirely of chrome-plated copper. A chrome plating is much harder than a nickel plating and therefore less sensitive to acids, scratches and damage. It completely eliminates the risk of chipping nickel plating. Additionally, chrome plating looks much more homogeneous and provides a shine that cannot be achieved by nickel plating. Chrome-plated coolers have previously only been used in the industrial sector in areas where extreme influences act on the coolers.

Design
The Aurora design of the Radeon RX 7XXX Eisblock generation is visually calmer and simpler. Only one O-ring runs around the entire cooler. The design around the cooling fins and jetplate makes for a cleaner look. The illumination of the digitally addressable RGB LEDs is even better distributed throughout the cooler as a result of the chrome plating. The terminal's design is in line with the classic Aurora design.

Thermal paste & thermal pads
The included thermal compound is Alphacool's Subzero. With a thermal conductivity of 16 W/mK, it is one of the highest performing thermal pastes on the market. The electrically non-conductive thermal compund is particularly well suited for high contact pressures, but can still be processed perfectly due to its viscosity of 850.000 TF. Alphacool Soft Pads with 1mm thickness are used on the voltage converter and the graphics memory. The thermal conductivity of the pads is 7 W/mK. The pads for the back of the PCB are 3mm thick and have a thermal conductivity of 3 W/mK.

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